PHONEFIX BA13 Multifunctional Desoldering Station L2024 Soldering pre-heating Platform For iPhone X-15 Pro Max Middle Layer Board Repair. PHONEFIX BA13 heating module also compatible with Mijing iRepair MS1 desoldering preheating platform for iPhone X-15 Pro Max motherboard CPU IC heating disassembly and glue removal.
Features:
- PHONEFIX BA13 pre-heating station for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max motherboard soldering separating.
- Four temperature presets are supported:Temp setting/CH setting/System setting/Temp Calibration.
- Phonefix BA13 Multifunctional constant temperature intelligent desoldering station Can support four languages) Settings are supported:Chinese/English/Portugues/Español.
- The temperature can be set to 4 memory modes:100℃, 150℃, 200℃, 250℃.
- iPhone X -15 Pro Max module + universal module + dot matrix module + follow-up unlimited upgrades.
- Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, the maximum temperature can be heated to 300℃, fast stratification, safe disassembly, no damage to the motherboard.
Option: (PHONEFIX BA13 heating module )
- Universal Module(MS1-U).
- Screen Face Fingerprint Module(MS1-F).
- For iphone X/XS/XS Max/11/11Pro/11Pro Max Module(MS1-A).
- For iphone 12/12Mini/12Pro/12Pro Max Module(MS1-B).
- For iphone 13/13Mini/13Pro/13Pro Max Module(MS1-C).
- For iphone 14/14Plus/14Pro/14Pro Max Module(MS1-D).
- For iphone 15/15Plus/15Pro/15Pro Max Module(MS1-E).
Specification:Item name: PHONEFIX BA13 Preheating Platform.
Brand: PHONEFIX.
Support model: X-15 Pro Max.
Temperature: 100℃-300℃.
Function Type: Layering and fitting of the main board, facial repair.
Package List:1 x BA13 Desoldering Station