Relife RL-403 High Quality 10CC Syringe Solder Paste Flux Soldering Paste Tin Sn63 / Pb67 20-38um for Phone Motherboard BGA Soldering Repair.Specification:
- Name: Relife RL-403 183℃ solder paste (syringe)
- Specifications: 10cc
- Alloy: Sn63/Pb37
- Microns: 20-38um
Features:
- Good adhesion. Paste delicate, particles small, only 20~38 microns.
- Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
- Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive
Package includes:
- 1pc x Relife RL-403 Solder Paste
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