0.12mm BGA Reballing Stencil Hisilicon Kirin 980 Hi3680 Isolation Mesh

DIYPHONE/AMAOE 0.12mm Isolation BGA Reballing Stencil for repairing Hisilicon Kirin 980 Hi3680 short-circuit problem caused by slight deformation. DIYPHONE 0.12mm Silver/Black BGA Reballing Stencil for Huawei Hi3680 short circuit soldering repair. 

Option:
1. Amaoe 980 Hi3680 0.12mm BGA Reballing Stencil for Huawei Hi3680 Short Circuit Isolation Stencil Repair.
2. DIYPHONE 980 Hi3680 BGA Reballing Stencil(silver): 0.12mm BGA Reballing Stencil for Huawei Hi3680 Short Circuit Isolation Stencil Repair.
3. DIYPHONE 980 Hi3680 BGA Reballing Stencil(black): 0.12mm BGA Reballing Stencil for Huawei Hi3680 Short Circuit Isolation Stencil Repair.

Package includes:
1 x 980 Hi3680 BGA Reballing Stencil