10CC RELIFE High Quality No-clean Original Solder Paste Flux

Relife RL-403 High Quality 10CC Syringe Solder Paste Flux Soldering Paste Tin Sn63 / Pb67 20-38um for Phone Motherboard BGA Soldering Repair.

Specification:

• Name: Relife RL-403 183℃ solder paste (syringe)
• Specifications: 10cc
• Alloy: Sn63/Pb37
• Microns: 20-38um

Features:

1. Good adhesion. Paste delicate, particles small, only 20~38 microns.
2. Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
3. Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding

Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive

Package includes:

• 1pc x Relife RL-403 Solder Paste
•