SHigh Quality 183℃ Medium Temperature Sn62.8 / Pb36.8 / Ag0.4 Lead-Free Solder Paste for Phone Motherboard BGA Chip Soldering Tin CreamTwo types of packaging:
- Syringe packaging: Needle tube - 42g
FIX-229 Sn62.8 / Pb8 / Ag0.4
FIX-228 Sn62.8 / Pb36.8 / Ag0.4
Features:
- Medium temperature Solder paste with lead, melting point is 183℃, Sn62.8 / Pb36.8 / Ag0.4
- Good conductivity, Shining solder joints, Good moisturizing, Full solder joint, Good tin drop performance
- With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
- Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.
- Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
- Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.
Package includes:
