2UUL Steel BGA Reballing Stencil for iPhone 11/12 Pro Max/XS/XS MAX/XR/X/8P/8/7P/7 /6S/6 CPU IC Chip Tin Planting Soldering Net
0.025mm Thickness: it is the basic stencil.
- Stepped groove design enables stencil to align with the tinning position of ic rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This stencil is easy to use no matter you are new or an expert.
- The high success rate of planting tin, the solder balls can be formed once after you are proficient.
- This planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.