Amaoe A13 Magnetic BGA Reballing Platform Positioning Plate with 0.10mm Thickness Stencil For iPhone 6 6P 6S 6SP 7 7P 8 8P X CPU Reballing Kit.
Amaoe Baseband CPU reballing stencil platform with 0.1mm steel mesh for iPhone 6 6P 6S 6SP 7 7P 8 8P X, Amaoe CPU RAM magnetic BGA reballing platform with positioning plate and 0.10mm thickness stencil plate for phone baseband CPU reballing kit, EMMC EMCP UFS BGA 153 162 169 186 221 254 universal maintenance platform planting tin net suit chip repair tools.
1. this stencil must use with Magnetic Reballing Platform+ Location Reballing Kit
2.for A8 A9 full set: it including A8 upper+A8 Lower /A9 upper+A9 Lower
3.or A10 A11full set: it including A10 upper+A10 Lower /A11 upper+A11 Lower
4.3.or A12 1full set: it including A12 upper+A12 Lower