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High Synthetic Lead-Free BGA Solder Paste Low / Middle / High Temperature Soldering Tin Cream for Mobile Phone PCB Soldering Iron Station Repair
Option BGA Solder Paste:
Option 1: high temperature Solder Paste QY-309SAC, Sn96.5Ag3Cu0.5
Option 2: middle temperature Solder Paste QY-309SnBiAg, Sn64Bi35Ag1
Option 3: low temperature Solder Paste QY-309Bi, Sn42Bi58
Option 4: Leaded Leaded QY-309A, Sn63/Pb37
Features:
The quality of solder paste, excellent wetting, high reliability.
Can effectively prevent the collapse of the printing and preheat, Tack lasting, easy to dry, sticky time for more than 48 hours.
A colorless transparent, does not affect the test, fine-clean and cleaning performance.
Products wetting, anti-dry and strong, long shelf life at room temperature.
Suitable for Adapted to the mobile phone repair industry, computer digital service industries, High-precision circuit board soldering SMT, BGA soldering processes, etc.
