Huawei HI series BGA reballing stencils kit Hi6250 Hi6220 Hi3660A steel template for Huawei CPU soldering repair tools, Amaoe 0.12mm CPU BGA stencils kit for Huawei CPU RAM reballing IC pin soldering heating net, universal BGA reballing stencil template net for Huawei CPU motherboard soldering repair tools, Hi6250 Hi6220 Hi3660A 0.12mm reballing stencils template, it will offer you best experience for professional mobile phone soldering fixes.
Amaoe Multi-function BGA Reballing Stencils Kit Soldering Template For Huawei Cellphone Logic Board Soldering Repair NetProduct Features :
- Amaoe Imported Japan for universal phone BGA reballing stencil template, 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For Huawei Phone CPU BGA Reballing Soldering Repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
