Huawei CPU BGA reballing stencils template rework net for Huawei G7 G8 7I 5S, Huawei G7 G8 7I 5S CPU series BGA reballing stencils template, MSM8916 MS8939 MT6753V CPU chip reballing stencils kit for Huawei G7 G8 7I 5S BGA soldering repair, 0.12mm Huiwei CPU BGA reballing kit for Huawei Android phone circuit board soldering repair, fastly and perfectly
Huawei G7 G8 7I 5S CPU BGA Reballing Stencils Kit For Android Mobile Phone Circuit Board Soldering Repair ToolProduct Features :
- Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For Huawei G7 G8 7I 5S Universal Phone BGA Reballing Soldering Repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
