Huawei HI series power IC BGA reballing stencils rework net for mobile phone motherboard soldering repair, Amaoe 0.12mm CPU BGA reballing stencils template net, Hi6555 Hi6553 Hi6561 Hi6422 Hi6421GFC Hi6421 B Hi6421 A CPU BGA reballing stencils template, Hi6522 Hi6551 Hi6523 BGA soldering stencils heat template kit, Huawei BGA direct heating template for phone motherboard soldering repair tool
AMAOE Huawei HI Series Power IC BGA Reballing Stencil Heat Template Repair Kit Hi6555 Hi6561 Hi6553 Hi6422Product Features :
- Amaoe Imported Japan for universal phone BGA reballing stencil template
- 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Pictures Show
- Type: Amaoe Universal BGA Reballing Template
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For Huawei universal phone BGA reballing soldering repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
