{"product_id":"jcid-bga60-315-all-in-one-emmc-ufs-pcie-nand-reballing-stencil","title":"JCID BGA60-315 All-in-One eMMC UFS PCIE Nand Reballing Stencil","description":"\u003cp\u003eJCID All-in-One NAND Reballing Stencil is crafted from specially hardened steel with a thickness of 0.15mm. It is compatible with a wide range of Apple and Android storage chip packages—including NAND, eMMC, UFS, and PCIE—and features superior durability and precision-cut apertures, making it ideal for reballing (tin planting) repairs on iPhone NAND chips.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eFeatures:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003e1. A single stencil integrates multiple mainstream NAND\/eMMC\/UFS\/BGA package specifications, minimizing the need for frequent stencil changes and significantly boosting repair efficiency.\u003cbr\u003e2. Compatible with reballing repairs for mainstream Apple and Android storage chips, offering a broader scope of application.\u003cbr\u003e3. Precisely aligns with chip solder pad layouts, ensuring more uniform solder ball placement and effectively reducing issues such as bridging (solder shorts) and misalignment.\u003cbr\u003e4. Constructed from specially hardened steel that is heat-resistant and highly resistant to deformation, making it suitable for frequent, long-term professional use.\u003cbr\u003e5. Optimizes solder ball formation results, thereby enhancing soldering stability and increasing the success rate of chip reballing operations.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(255, 42, 0);\"\u003e\u003cstrong\u003eSupported Chips\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003eThe stencil integrates various mainstream storage chip package structures, primarily covering eMMC, UFS, NAND, and PCIE chips:\u003cbr\u003e\u003cstrong\u003e· \u003c\/strong\u003eUFS Series: UFS153\/169\/254\/297\u003cbr\u003e\u003cstrong\u003e· \u003c\/strong\u003eeMMC Series: eMMC100\/153\/162\/169\/186\u003cbr\u003e\u003cstrong\u003e· \u003c\/strong\u003eBGA Series (General \u0026amp; Specialized Packages): BGA60, BGA70, BGA110, BGA315.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eProduct Specifications\u003c\/strong\u003e\u003cbr\u003eBrand: JCID\u003cbr\u003eName: All-in-One NAND Reballing Stencil\u003cbr\u003eMaterial: Specially Hardened Steel\u003cbr\u003eThickness: 0.15mm\u003cbr\u003eCompatible Devices: Apple\/Android\u003cbr\u003eCompatible Chips: NAND\/eMMC\/UFS\/PCIE\u003cbr\u003eFunction: Chip Reballing, BGA Rework, Storage Drive Repair\u003cbr\u003e\u003c\/p\u003e","brand":"PHONEFIX","offers":[{"title":"JCID NAND Stencil \/ Free Sample (Up to 1)","offer_id":49082781532389,"sku":"JCIDNS1","price":0.0,"currency_code":"USD","in_stock":true},{"title":"JCID NAND Stencil \/ 1pcs","offer_id":49225654501605,"sku":"JCIDNS1","price":0.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0307\/0073\/2554\/files\/JCID_1.jpg?v=1779099707","url":"https:\/\/www.diyfixtool.com\/products\/jcid-bga60-315-all-in-one-emmc-ufs-pcie-nand-reballing-stencil","provider":"CHINA PHONEFIX SHOP Team","version":"1.0","type":"link"}