{"product_id":"jtx-t4-max-phone-cpu-emmc-ram-glue-removal-reballing-platform","title":"JTX T4 MAX Phone CPU\/EMMC\/RAM Glue Removal Reballing Platform","description":"\u003cp\u003eJTXTOOLS T4MAX Glue Removal \u0026amp; Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians performing chip-level rework and micro-soldering.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eFeatures:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003e1. Supports soldering needs for various chips including Apple CPUs, EMMC, RAM, and Android chips from Qualcomm, Exynos, HiSilicon, and Dimensity.\u003cbr\u003e2. Integrates glue removal, positioning, and soldering functions, reducing equipment investment and improving repair efficiency.\u003cbr\u003e3. Employs a magnetic positioning structure for automatic alignment and secure chip fixation, reducing the risk of operational misalignment.\u003cbr\u003e4. High-precision 3D stencils help achieve more uniform solder ball formation, improving soldering quality.\u003cbr\u003e5. Dedicated adhesive removal and positioning structure assists in removing residual adhesive, reducing chip damage.\u003cbr\u003e6. Upgraded 17 types of solder mesh to meet the repair needs of different CPU, RAM, and memory chip models.\u003cbr\u003e7. Processed from aerospace-grade aluminum, featuring high strength, wear resistance, and long-term stable use.\u003cbr\u003e8. Constructed from selected high-toughness steel, wear-resistant and durable, ensuring long-term precision.\u003cbr\u003e9. Equipped with rubber feet, providing anti-slip, shock absorption, aging resistance, and high-temperature resistance.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eProduct Parameters\u003c\/strong\u003e\u003cbr\u003eBrand: JTXTOOLS\u003cbr\u003eEnglish Name: T4 MAX Glue Removal \u0026amp; Reballing Platform\u003cbr\u003eProduct Application: Chip positioning, glue removal, and soldering\u003cbr\u003eSupported Chip Types: CPU \/ EMMC \/ RAM\u003cbr\u003eCompatible Platforms: Apple \/ Android\u003cbr\u003eSupported Chip Quantity: 102 chip models\u003cbr\u003eSolder Reballing Mesh Quantity: 17 models\u003cbr\u003eProduct Material: Aviation Aluminum\u003cbr\u003eSteel Mesh Material: High-quality steel\u003cbr\u003eProduct Dimensions: 120x59x15mm\u003cbr\u003ePositioning Method: Magnetic automatic positioning clamping\u003cbr\u003eDesign Structure: Two-in-one glue removal and soldering design\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eSupported Models for Soldering Mesh\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e· \u003c\/strong\u003eApple Series: Apple CPU, Apple EMMC, Apple RAM\u003cbr\u003e\u003cstrong\u003e· \u003c\/strong\u003eAndroid Series:\u003cbr\u003eQualcomm Series: Qualcomm 01-06\u003cbr\u003eExynos Series: Exynos 01-02\u003cbr\u003eHiSilicon Series: HiSilicon 01-02\u003cbr\u003eDimensity Series: Dimensity 01-02\u003cbr\u003eAndroid RAM Universal Soldering Mesh\u003cbr\u003e\u003c\/p\u003e","brand":"PHONEFIX","offers":[{"title":"T4 MAX reballing set","offer_id":50566296797413,"sku":"T4MAX","price":25.09,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0307\/0073\/2554\/files\/T4MAX_1.png?v=1784712894","url":"https:\/\/www.diyfixtool.com\/products\/jtx-t4-max-phone-cpu-emmc-ram-glue-removal-reballing-platform","provider":"CHINA PHONEFIX SHOP Team","version":"1.0","type":"link"}