PHONEFIX Low/ Medium / High Temperature Lead-Free Solder Paste Flux BGA Soldering Paste for Cell Phone Circuit Board Welding and BGA Stenciling Repair.
Out Of Stock. Replacement: SFD Solder Paste
Option Type :
- Option 1: high temperature: 260℃ - 32.6g
- Option 2: medium temperature: 183℃ Sn62.8/Pb36.8/Ag0.4 - 50.0g
- Option 3: low temperature: 138℃ Sn42/Bi68 Lead-Free - 50.0g.
Description :
- High temperature is 260 °C, medium temperature is 183°C, low temperature is 138°C.
- High performance, no solder bead, easy to dry, high insulation resistance.
- This high quality solder paste can be available for different temperature to allow more precision cell phone PCB BGA soldering repair.
- Low temperature 138℃ Sn42/Bi68 and medium temperature 183℃ Sn62.8/Pb36.8/Ag0.4 solder paste for mobile phone PCB repair.
- LANRUI Low Temperature Lead Free Solder Paste, No-clean, Less residual, Shinning and full welding spot, lead-free and low temperature.
- High Conductivity LANRUI Solder Paste with Lead and Silver No-clean, Less residual, Shining and full welding spot, optional medium and low temperature.
Specification :
- Brand: PHONEFIX
- Warranty: 1 year
- Origin: Shenzhen, China
- Material: Lead Free / Lead
- Color: Gray
- Product model:
- Melting point: 138℃ Low Temperature and 183℃ Medium Temperature, 260 ℃ High Temperature
- Main purpose: PCB Pad Welding
- Storage environment: Room temperature / Cold storage
Peculiarities :
- With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
- Wettability and demold properties are good, anti-cold&hot collapse and anti-dry are strong.
- Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection displacement phenomenon.
- Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.
Package includes :
