{"product_id":"mecahnic-magtin-max-iphone-android-magnetic-reballing-platform","title":"MECAHNIC MagTin Max iPhone \u0026 Android Magnetic Reballing Platform","description":"\u003cp\u003eMECHANIC MagTin Max is a professional-grade dual-sided magnetic BGA reballing platform with BGA stencils designed for Apple iPhone and Android like Qualcomm, MTK, Exynos, Hisilicon chips. Heat-resistant, precise alignment for BGA reballing. Featuring a strong magnetic dual-sided base, it securely holds chips and stencils in place during BGA reballing, eliminating gaps where solder paste could seep in and ensuring uniform ball placement. Ideal for CPU, NAND, and IC reballing.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eFeatures:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003e1. The dual-sided magnetic design features Side A dedicated to Apple chips (0.6mm thickness) and Side B for Android chips (0.35mm thickness), supporting a wide range of mainstream chip reballing needs with a single tool.\u003cbr\u003e2. Flipping the platform immediately starts the next chip reballing operation without the need for base replacement or repositioning, simplifying workflow and significantly boosting efficiency.\u003cbr\u003e3. Magnetic attraction technology enables automatic stencil alignment and locking in one step, with every “click” ensuring precise positioning for consistent soldering quality.\u003cbr\u003e4. The groove structure design effectively enhances heat dissipation, keeping the platform cool, quiet, and stable during operation to prevent positioning drift caused by heat buildup.\u003cbr\u003e5. The stencil library is continuously updated in real time, with 90 precision steel stencils covering Apple (A10–A19 Pro), Qualcomm (Snapdragon 8\/7\/6 series), MediaTek (Dimensity series), Exynos, HiSilicon (Kirin), and EMMC\/RAM chips\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eCPU stencil models (90pcs):\u003c\/strong\u003e\u003cbr\u003e\u003cstrong\u003e1. Qualcomm (21pcs):\u003c\/strong\u003e\u003cbr\u003eSM8750\u003cbr\u003eSM8450\u003cbr\u003eSM8150\u003cbr\u003eSM7325\u003cbr\u003eSM7125\u003cbr\u003eSM8650\u003cbr\u003eSM8350\u003cbr\u003eSM7550\u003cbr\u003eSM7250\u003cbr\u003eSM7750\u003cbr\u003eSM6450\/SM7435\u003cbr\u003eSM8550\u003cbr\u003eSM7150\u003cbr\u003eSM7450\u003cbr\u003eSM8475\/SM7475\u003cbr\u003eSM8250-102\u003cbr\u003eSM7350\u003cbr\u003eSM8250-002\u003cbr\u003eSM7225-00AB\u003cbr\u003eSM8850\u003cbr\u003eSM8735\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003e2. iPhone (12pcs):\u003c\/strong\u003e\u003cbr\u003eA19 PRO\u003cbr\u003eA19\u003cbr\u003eA18 PRO\u003cbr\u003eA18\u003cbr\u003eA17\u003cbr\u003eA16\u003cbr\u003eA15\u003cbr\u003eA14\u003cbr\u003eA13\u003cbr\u003eA12\u003cbr\u003eA11\u003cbr\u003eA10\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003e3. Hisilicon (12pcs):\u003c\/strong\u003e\u003cbr\u003eHi36C0\u003cbr\u003eHi3690-5G\u003cbr\u003eHi6280\u003cbr\u003eHi36A0\u003cbr\u003eHi3670\u003cbr\u003eHI36D0\u003cbr\u003eHi36A0\u003cbr\u003eHi3690-4G\u003cbr\u003eHi3680\u003cbr\u003eHi6290\/L\u003cbr\u003eHI6290\u003cbr\u003eHI62B0\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003e4. MTK (21pcs):\u003c\/strong\u003e\u003cbr\u003eMT6989W\u003cbr\u003eMT6895Z\u003cbr\u003eMT6855V\u003cbr\u003eMT6853V\u003cbr\u003eMT6983Z\u003cbr\u003eMT6885Z\u003cbr\u003eMT6873V\/6875V\u003cbr\u003eMT6891Z\/6893Z\u003cbr\u003eMT6878V\u003cbr\u003eMT6899Z\u003cbr\u003eMT6991Z\u003cbr\u003eMT6985W\u003cbr\u003eMT6897Z\u003cbr\u003eMT6877V\u003cbr\u003eMT8781\/MT6789V\u003cbr\u003eMT6761V\/6762V\/6765\u003cbr\u003eMT6833V\u003cbr\u003eMT6886V\u003cbr\u003eMT6781V\u003cbr\u003eMT6835V\u003cbr\u003eMT6993Z\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003e5. Exynos (12pcs):\u003c\/strong\u003e\u003cbr\u003eExynos 2200\u003cbr\u003eExynos 9820\u003cbr\u003eExynos 8895\u003cbr\u003eExynos 2100\u003cbr\u003eExynos 980\u003cbr\u003eExynos 990\u003cbr\u003eExynos 1330-E8535P\u003cbr\u003eExynos 1380-E8835P\u003cbr\u003eExynos 1480-E8845\u003cbr\u003eExynos 1280-E8825\u003cbr\u003eExynos 9815\/1080\u003cbr\u003eExynos2400-E9945\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003e6. EMMC+RAM (12pcs):\u003c\/strong\u003e\u003cbr\u003eBGA 254\u003cbr\u003eBGA 169\u003cbr\u003eBGA 134\u003cbr\u003eBGA 436\u003cbr\u003eBGA 178\u003cbr\u003eBGA 153\u003cbr\u003eBGA 186\u003cbr\u003eBGA 162\u003cbr\u003eBGA 556\u003cbr\u003eBGA 376\u003cbr\u003eBGA 496\u003cbr\u003eBGA 221\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eProduct Parameters:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003eBrand: MECHANIC\u003cbr\u003eProduct Name: Dual-Sided Magnetic Reballing Platform\u003cbr\u003eModel: MagTin Max 2.0\u003cbr\u003eProduct Dimensions: 55mm × 73mm × 11mm\u003cbr\u003ePackage Dimensions: 65mm × 37mm × 78mm\u003cbr\u003eNet Weight: 79g\u003cbr\u003eGross Weight: 290g\u003cbr\u003eStencils Included: 90 pieces\u003cbr\u003eSide A Compatibility: Apple Chips (0.6mm)\u003cbr\u003eSide B Compatibility: Android Chips (0.35mm)\u003cbr\u003eCompatible Chips: MT69937, Tianyu 9500, A19, A19 Pro, SM8735, Snapdragon 8s Elite, HiSilicon X9, and more\u003cbr\u003eNote: Product shown is a rendered effect with manual measurements; actual product may vary.\u003c\/p\u003e","brand":"PHONEFIX","offers":[{"title":"MagTin Max 2.0 Base+90pcs stencils","offer_id":52782230831333,"sku":"MagTin2.0","price":48.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0307\/0073\/2554\/files\/MagTinMax2.0-2.jpg?v=1788775745","url":"https:\/\/www.diyfixtool.com\/products\/mecahnic-magtin-max-iphone-android-magnetic-reballing-platform","provider":"CHINA PHONEFIX SHOP Team","version":"1.0","type":"link"}