How to use:
1. Before the operation, please clean the position which need to be repair and dry it with hot gun after clean up.
2. Then please coat the MECHANIC solder mask ink with blade and smear the solder mask ink as much as possible evenly. the coating is thinner the better try your best to eliminate the bubbles.
3. Then put the stecilis ( the printed side) down close to the solder pad and let the solder
pad of stecilis and the chip match exactly
4. Base on the thickness of the solder mask ink, the solder mask ink on the board will have a fast curing by the UV light for 5-20seconds , expect the solder pad of the chip.
5. Then we tear the stecilis slowly , and then use the UV light to curing the solder mask ink after wash board by MECHANIC PCB cleaning agent or alcohol
Warm prompt: To prevent the solder mask ink sticky the stencilis, it is recommended to coat the stencilis with the flux.