Mijing IPX2008 IPX861 Nozzles for QUICK 861DW 2008 hot air gun. MJ hot air nozzle for iPhone X/XS/XS MAX motherboard heating soldering repair. MJ iPhone X series nozzle for 861DW 2008 hot air rework station. MJ hot air nozzles for iPhone motherboard heating soldering repair. MiJing Hot Air Gun Nozzlefor Quick 861DW 2008 Hot Air Soldering Station for Repair iPhone X Motherboard Mainboard.
Description: Dedicated for iPhone X motherboard, special design, easy and quick disassembly of double-layer motherboard
Protect the NAND/PCIE, CPU, WIFI, baseband, does not cause imaginary welding
Compatible only for Quick 861DW or Quick2008.
Customized Microscope Heat Gun Nozzle Sleeve for iPhone X Series Folded-over Logic Board Desoldering Tool for QUICK 861DW / TR1300A Hot Air Soldering Station
iPhone X logic board was folded in half, two layers then were soldered together, the upper layer is the mainboard, and the lower layer is the signal board. Which made our repair much difficult to proceed, how to repair iPhone X logic board in fast and efficient method, need the professional iPhone X motherboard repair tools.
Package List:
- 1pc x Motherboard Hot Air Gun Nozzle
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