{"product_id":"mijing-r11-r12-degumming-fixture-for-bga-ic-soldering-glue-removal","title":"MIJING R11 R12 Degumming Fixture for BGA IC Soldering\/Glue Removal","description":"\u003cp\u003eMIJING R11 Rotatable Chip Holder and R12 IC Glue Removal Fixture for Mobile Phone Repair and Electronic BGA Soldering Repair. MIJING R11\/R12 CPU IC Clamp Soldering Fixture supports chips of various sizes and is suitable for precise fixation during chip desoldering and adhesive removal repair processes.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eFeatures:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003e1. The MIJING R11 IC Clamp features a rotating open-and-close design that allows for easy handling of black adhesive on chip packages and supports a wide range of chip sizes.\u003cbr\u003e2. The Mijing R12 chip removal fixture offers a large-travel design suitable for securing large chips and mobile phone CPUs—making it particularly ideal for precise immobilization during chip debonding and repair processes.\u003cbr\u003e3. Rotating Open-and-Close Design: The R11 features a rotating mechanism that allows for effortless opening and closing, significantly enhancing operational convenience.\u003cbr\u003e4. Black Adhesive Handling: The R11 is specifically designed to facilitate the removal and management of black adhesive found on chip packages, thereby boosting repair efficiency.\u003cbr\u003e5. Multi-Size Chip Compatibility: The R11 supports various chip specifications, offering broad compatibility across different components.\u003cbr\u003e6. Large-Travel Design: The R12 provides a maximum travel distance of 23.5mm, making it suitable for securing and debonding larger chips.\u003cbr\u003e7. Premium Materials: Both the R11 and R12 are crafted from high-grade materials, ensuring superior quality and long-term durability.\u003cbr\u003e8. Support for Large Chips \u0026amp; Mobile CPUs: The R12 is engineered specifically for large-format chips and the majority of mobile phone CPUs, enabling it to handle more complex repair tasks.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eProduct Specification:\u003c\/strong\u003e\u003cbr\u003eBrand: MIJING\u003cbr\u003eModel: R11 \/ R12\u003cbr\u003eDimensions:\u003cbr\u003e· R11: Φ80 x 20mm\u003cbr\u003e· R12: 100 x 72 x 23mm\u003cbr\u003eWeight:\u003cbr\u003e· R11: 200g\u003cbr\u003e· R12: 136.5g\u003cbr\u003e\u003c\/p\u003e","brand":"PHONEFIX","offers":[{"title":"R11 clamp","offer_id":48621373391077,"sku":"MJR1112","price":9.55,"currency_code":"USD","in_stock":true},{"title":"R12 fixture","offer_id":48621373423845,"sku":"MJR1112","price":7.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0307\/0073\/2554\/files\/1_d4c96dba-8da9-4ca7-a9de-32f827bd35ee.jpg?v=1774693554","url":"https:\/\/www.diyfixtool.com\/products\/mijing-r11-r12-degumming-fixture-for-bga-ic-soldering-glue-removal","provider":"CHINA PHONEFIX SHOP Team","version":"1.0","type":"link"}