{"product_id":"mijing-r13-phone-bga-ic-degluing-clamp-sp1-glue-cleaning-blade","title":"MIJING R13 Phone BGA IC Degluing Clamp \u0026 SP1 Glue Cleaning Blade","description":"\u003cp\u003eMijing R13 Heat-Insulating Tempered Glass IC Glue Removal Platform \u0026amp; Mijing SP1 CPU IC Black Glue Cleaning Knife for Mobile Phone Repair. Non-damaging IC chips and PCB solder pads, safely glue removal. R13 adjustable IC fixture features a dual-thickness worktable, a rotary stepless distance adjustment, ensuring secure chip fixation and preventing displacement. Used with the SP1 heat-resistant blade, it provides stable clamping and gentle adhesive removal, making it particularly suitable for repairing precision electronic products such as mobile phone motherboards, computer hard drives, graphics cards, and various BGA chips.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eMIJING R13 Adjustable Clamp Features:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003e1. Tempered glass panel, scratch-resistant and durable surface for long-term use.\u003cbr\u003e2. Double-thickness work station design (0.3mm \/ 0.4mm \/ 0.5mm), accurately adapts to thin and thick IC chips.\u003cbr\u003e3. Stepless knob adjustment, allows fine-tuning of clamping spacing for universal compatibility with small and large ICs.\u003cbr\u003e4. Serrated tooth grip structure, anti-shift clamping for stable, non-slip operation during glue removal.\u003cbr\u003e5. Suitable for glue removal and pin repair on BGA, CPU, IC, and other devices, versatile for multiple repair scenarios.\u003cbr\u003e\u003cbr\u003e\u003cspan style=\"color: rgb(0, 170, 255);\"\u003e\u003cstrong\u003eMIJING SP1 Heat-Resistant Scraper Features:\u003c\/strong\u003e\u003c\/span\u003e\u003cbr\u003e1. Imported PI (VESPEL-SP1) material, excellent high-temperature resistance; softens and becomes more flexible when heated, conforming to surfaces for easier glue removal.\u003cbr\u003e2. Soft engineering plastic design, will not scratch IC surfaces, safe for chips.\u003cbr\u003e3. Thin blade design, easily inserts under chips to remove residual glue, eliminating the risk of lifting pads or scratching circuits.\u003cbr\u003e4. Detachable blade design, flexible material cleans black glue without scratching IC chips or damaging PCB pads.\u003cbr\u003e5. Specifically developed for stubborn black glue on CPU and IC underfill, effectively reduces repair failure risk.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eMIJING R13 Adjustable Clamp Product Parameters:\u003c\/strong\u003e\u003cbr\u003eBrand: MIJING\u003cbr\u003eModel: R13\u003cbr\u003eProduct Dimensions: 100mm × 72mm × 23mm\u003cbr\u003eNet Weight: 200g\u003cbr\u003eMaterial: Tempered Glass Panel\u003cbr\u003eClamping Adjustment: Stepless Knob Adjustment\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003eMIJING SP1 Heat-Resistant Scraper Product Parameters:\u003c\/strong\u003e\u003cbr\u003eBrand: MIJING\u003cbr\u003eModel: SP1\u003cbr\u003eProduct Dimensions: 200mm × 55mm\u003cbr\u003eNet Weight: 24.5g\u003cbr\u003eMaterial: Imported PI (VESPEL-SP1) Specialty Engineering Plastic\u003cbr\u003e\u003c\/p\u003e","brand":"PHONEFIX","offers":[{"title":"MIJING R13 Clamp","offer_id":52730399752421,"sku":"R13SP1","price":7.99,"currency_code":"USD","in_stock":true},{"title":"MIJING SP1 Blade","offer_id":52730399785189,"sku":"R13SP1","price":5.09,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0307\/0073\/2554\/files\/MIJINGR13SP1.jpg?v=1788229992","url":"https:\/\/www.diyfixtool.com\/products\/mijing-r13-phone-bga-ic-degluing-clamp-sp1-glue-cleaning-blade","provider":"CHINA PHONEFIX SHOP Team","version":"1.0","type":"link"}