0.8mm iPhone X PCB Repair Heat insulation Plate is professional 0.8mm glass fiber panel, for iPhone X PCB soldering and repairing Heat insulation tool, 0.8mm glass fiber heat shield is used for preventing the damage because of iPhone X motherboard suspension design when operation with tweezers during reballing process,
0.8mm iPhone X PCB Repair Heat insulation glass fiber shield Protector glass fiber shield Protector also protect the IC chip from heating damage by BGA rework station. The heat resistant protector will do great performance for iPhone X PCB repair.
1. When the iPhone X motherboard is reballing,the middle of reballing stencil is easy to drop when tweezers presing it, putting the plate on iPhone X motherboard so as to reduce the suspended position and prevent any damage.
2. Heat insulation, it's neccessary to return and blow solder ball after reballing, it can help to protect the chip.