MSM8976 CPU BGA Reballing Stencils Template For VIVO X6 X7 X9P

Amaoe MSM8976 8956 R9P R9SP CPU IC BGA reballing stencils template kit for VIVO X6 X7 X9P X9S MI MAX motherboard repair, MSM8976 MSM8956 CPU BGA reballing stencil template for VIVO X6 X7 X9P X9S logic board soldering repair tools, Vivo X6 X7 X9P X9S MI MAX BGA soldering stencils mesh kit, multi-purpose R9P R9SP CPU IC BGA reballing stencils template for Android mobile phone repair

Amaoe MSM8976 8956 R9P R9SP CPU IC BGA Reballing Stencils Template For VIVO X7 X9P MI MAX Motherboard Soldering Repair

Product Features :

1. Amaoe Imported Japan for universal phone BGA stencils template kit
2. 100% new brand and high quality.
3. Super thin thickness, just 0.12mm, easy to use.
4. Special designed: Heat dissipating holes design.
5. High quality steel material, can work great with any universal phone repair BGA rework station.
6. Offer the best BGA Repair solution for phone heating repair.

Product Specifications :

• Item name: BGA Reballing Stencil Template
• 100%: High quality
• Model: OP: 2
• Material: Imported Japan steel sheet
• Color: As pictures show
• Type: Amaoe universal BGA reballing template
• Thickness: 0.12mm
• Design: Heat dissipating holes design
• Unit Type: Piece
• Suitable for: for general rework station
• Function: for phone BGA reballing

Package includes :

• 1pcs x BGA Reballing Stencil