Amaoe MT6572A CPU BGA reballing stencil 0.12mm IC chip soldering tin plant net direct heating template for mobile phone soldering and reballing repair, MT6572A for mobile phone BGA repair rework station steel mesh, MT6572A CPU chip BGA stencil direct heating template, IC chip BGA reballing stencil template 0.12mm soldering steel net for cellphone reballing repair
Amaoe BGA Reballing Stencil Template 0.12mm MT6572A Steel Mesh For Mobile Phone CPU BGA Soldering Repair ToolProduct Features :
- Imported Japan Amaoe for universal phone BGA Reballing Stencil Template, 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Professional Tin plant steel mesh for MT6572A universal upper lower layer soldering repair.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Can work great with any universal phone repair BGA rework station MTK CPU series Tin plant net .
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- Model Number: MT6572A
- 100%: High quality
- Material: Imported Japan Steel Sheet
- Color: As Picture Show
- Thickness: 0.12mm
- Design: Heat Dissipating Holes Design
- Application: For MT6572A Universal Phone BGA Reballing Soldering Repair
- Unit Type: Piece
- Suitable for: for General Rework Station
- Function: for Phone BGA Reballing
Package includes :
- 1pcs x BGA Reballing Stencil
