Meizu MX4 0.12mm universal CPU BGA reballing stencil template, 0.12mm MT6595W CPU BGA reballing stencils kit direct heating template for Meizu MX4 soldering repair tool, 0.12mm BGA reballing stencil for Meizu MX4 CPU RAM power audio wifi IC soldering repair, CPU BGA stencils kit with imported steel material and heat dissipating holes for phone repair BGA soldering rework station.
0.12mm Meizu MX4 BGA Reballing Stencils Kit Direct Heating Template MT6595W For Android Phone CPU RAM Soldering Repair ToolProduct Specification :
- Item name: BGA Stencils Kit
- Brand name: Amaoe
- Model: MT6595W MZ:1
- Material: Stainless Steel
- Color: Silver
- Unit Type: Piece
- Thickness: 0.12mm
- Package weight: 0.01kg
- Compatible with: Meizu MX4
Package included :
- 1pcs x BGA Reballing Stencil Template