QianLi ToolPlus iP-01 iP-02 Middle layer frame BGA reballing stencil platform for iPhone X XS XS MAX 1 Pro MAX motherboard repair, ToolPlus iP-01 iP-02 iPhone middle layer planting tin soldering fixture, Qianli 3D BGA reballing metal stencil motherboard middle frame planting tin reballing platform for iPhone logic board repair net fixture
QianLi ToolPlus iP-01 iP-02 BGA Reballing Platform for iPhone X-11 Pro Max Logic Board Dissembling and Assembling Testing Tool [ Optional BGA Platform ] :
- Option 1: QianLi ToolPlus iP-01 for iPhone X/XS/XSMax
- Option 2: QianLi ToolPlus iP-02 for iPhone 11/11Pro/11Pro Max
Features :
- Durable, unique design
- Seiko, featured material
- Precise positioning
- Efficiency Improvement
- Strong magnetic attraction
- Stencils won't deform under high temperature
- High quality Phone Middle Frame Reballing Platform
- BGA Reballing Platform for iPhone X/XS/XS MAX/11/11 Pro/11 Pro MAX.
- Make your repair work easier
Specification :
- Material: Metal
- Color: Gray
- Size: 99mm * 60mm * 15mm
How to use : Step 1 : Put the mainboard into the tin-planting card slot
Step 2 : Align the corresponding tin planting mesh with the right position
Step 3 : Put the solder paste into the stencil by scraper
Step 4 : Using hot air gun to blow solder paste until it melts
Package included :
- 1pcs x BGA Reballing Platform
