Special BGA PCB chip remover burin used for removing CPU IC chip NAND from mobile phone mainboard, PCB repair tool, iPhone BGA chip knife tool will remove IC chip from motherboard, with 11pcs ultra thin blades and 2pcs handles, operate convenient.
The Special iPhone BGA Chip Remover Blades used for Remove IC Chip CPU NAND From Phone Motherboard PCB RepairSpecification :
- Material: Stainless steel
- Type: BGA removal graver blade
- Design: 11pcs blades in different shape
- Weight: 0.2kg
Product Features :
- Made of stainless steel
- Specially designed for iPhone / cell Phone
- Used to repair logic board CPU
- 11 pcs blades in different shape and 2pcs Handles
- Easy to use
- Operate convenient
- In storage box
Package includes :
- 2pcs Handles
- 11pcs Blades