Amaoe MQ1 MQ2 MQ3 MQ4 reballing stencil for Qualcomm MTK CPU RAM soldering repair. 0.12MM High quanlity CPU RAM BGA reballing Solder template stencil for SDM710 /SDM845 /SDM660/SDM636 MT6771V/MT6739V/MT6763V/MT6757V. Amaoe MQ1 MQ2 MQ3 MQ4 For MTK Chip CPU BGA Stencil MT6771V SDM845 SDM710 MT6739V MT6757V SDM660 IC Solder Reballing Tin Pin Heating Template.
Features:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
Option:
MQ:1 stencil: For Qualcomm MTK MT6771V, SDM845 B, SDM710, MT6739V, MT6757V, SDM845 A, SDM660, MT6763V.
MQ:2 stencil: For Qualcomm MTK MSM8909W RAM, MT6761V, MT6779V, MT6758V, MSM8909W CPU, SDM439, MT6765V, MT6768V.
MQ:3 stencil: For Qualcomm MTK SM8250 RAM, MT6885Z RAM, Snapdragon 865, SM7150, SM8250 CPU, MT6885Z CPU, SM6125, SM7150.
MQ:4 stencil: For SM8350 SM8450 SM7315 SM7325 MT6833V MT6799W MT6877V RAM CPU IC Chip
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