MJ 3D BGA Reballing stencil For iPhone 6 to iPhone 13 Pro Max soldering repair. Mijing 3D BGA reballing stencil template groove for iPhone A8 A9 A10 A11 A12 A13 A14 A15 CPU soldering repair. MJ 3D BGA reballing steel stencil plate for iPhone soldering tool, iPhone BGA Reballing Stencil Steel Net, iPhone A8 A9 A10 A11 A12 A13 A14 A15 plant tin steel mesh.
MiJing 3D BGA Reballing Stencil Template New Patented Groove BGA Rework Steel stencil Net For iPhone A8 A9 A10 A11 A12 A13 A14 A15 Repair.[ Optional BGA Stencil ] :
- Option 1: MJ 3D A8 For iPhone 6 6P
- Option 2: MJ 3D A9 For iPhone 6S 6SP
- Option 3: MJ 3D A10 For iPhone 7 7P
- Option 4: MJ 3D A11 For iPhone 8 8P X
- Option 5: MJ 3D A12 For iPhone XS MAX
-
Option 6: MJ 3D A12 For iPhone XR
- Option 7: MJ 3D A13 For iPhone 11 Pro MAX
- Option 8: MJ 3D A14 For iPhone 12 series
- Option 9: MJ 3D Stencil A15 for iPhone 13 series.
MJ 3D A8: iPhone 6/6 plus IC: Touch IC, Baseband, Font IC, Audio IC, Power IC, A8 CPU
MJ 3D A9: iPhone 6s/6s plus: Touch IC, Baseband, Font IC, Audio IC, Power IC, A9 CPU
MJ 3D A10: iPhone 7 /7plus: Touch IC, Baseband, Font IC, Audio IC, Power IC, A10 CPU
MJ 3D A11: iPhone 8 /8plus X: NAND Flash, Touch IC, Baseband, Font IC, Audio IC, Power IC, A1A CPU
Groove (Automatic counterpoint) Reballing Stencil Template For iPhone A8 A9 A10 A11, 3D Groove Reballing Stencil Template Net
Features :
- Stepped groove design enables stencil to align with tinning position of IC rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are a new or expert.
- High success rate of planting tin, the solder balls can be formed once after you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.
Package included :
- 1pcs x BGA Reballing Stencil Template
