Upgraded QUICK 2008D+ lead-free desoldering station 750W hot air gun for Mobile Phone LCD display motherboard BGA IC soldering repair. QUICK 2008 rework station 700W hot air gun for Mobile Phone LCD motherboard BGA IC soldering repair. Original QUICK 2008/QUICK 2008D+ LCD digital display hot air gun ESD soldering rework station for mobile phone BGA IC components desoldering and soldering repair.
Option:
1. QUICK 2008.
2. QUICK 2008D+.
Note: 110V, need Customized, time: about 3-5 days.
Specification:
1. QUICK 2008
-Display Type: LCD
-Power: 700W
-Voltage: AC 110V/220V
-Temperature Range: 100℃-500℃
-Air volume ratio range: 1 ~ 120
-Maximum airflow: 120 L / min
-Airflow type: brushless fan soft wind
-Display: LED digital (resolution 1° C)
2. QUICK 2008D+
-Display Type: LCD
-Power: 750W
-Voltage: 110V/220V
-Temperature: 100℃-500℃
-Air Volume Range: 1-100 Level
-Air Volume: 30L/min(Max)
-Product Size: 170*151*98mm
-Package Size: 330*180*230mm
-Net Weight: About 1.5kg
The characteristics:
- Sensors, closed circuit, the zero passage trigger temperature control of the microcomputer, LED display, big power, heating is rapid, accurate and stable temperature, not affected by the air volume, truly lead-free desoldering.
- Adjustable air flow, air volume big and soft wind, temperature control is convenient, can be suitable for a variety of purposes.
- The handle is equipped with induction switch, as long as the hand shake hands handle, the system can quickly enter the working mode; Handle is released into the handle frame, the system will enter the standby mode, easy to operate in real time.
- The system is equipped with automatic air cooling function, can prolong the life of heating element and protect the heat gun.
- Adopts brushless fan very long life, small noise, using high quality heating element under the same power efficiency can be doubled, and can effectively prolong the working life of the heating element and power saving.
- The machine is equipped with safety protection function.
Usage:
Desoldering is suitable for a variety of components, such as: SOIC, CHIP, QFP, PLCC, BGA (especially suitable for mobile phone line and row line of desoldering); Used for heat shrinkable, drying, in addition to the paint, in addition to the glue, thawing, preheating, welding, etc.
Skip to content