- The blade is made of special steel, laser cutting, manual polishing, moderate hardness, flexibility, comfortable feel, hardness, and toughness.
- Separation of dot matrix, glue removal from the bottom of the board, wire break assistance, removal of large chips.
- It is suitable for separating dot-matrix/board bottom glue removal/large chip removal/disconnection assistance, etc., to meet your maintenance needs.
- The blade is hardened, the cutting edge is ultra-thin, the slope on both sides is polished at the same time, and the blade is evenly stressed on both sides from thick to thin.
- Super toughness, better protection of mobile phone chips.
- With a universal handle, high-quality material selection, and a strong guarantee of product quality.
- Mobile phone repair commonly used blades, hard disk removal, removal of mobile phone chips, motherboard CPU layering.
- 1 x Handle
- 10 x Blade
- 1 x Disassembler