MIJING iRepair MS1 Desoldering Station with iPhone X-17 Pro Max Heating Molds for iPhone motherboard separation, CPU IC heating disassembly and glue removal. iRepair MS1 Preheating Platform Desoldering Station with various heating modules for iPhone X/11/12/13/14/15/16/17 Pro Max PCB CPU IC camera dot matrix repair.
Mijing has released the MS1-17 series heating module for iPhone 17/Air/17 Pro/17 Pro Max repair.
New MS1-Camera-A/B/C/D/E Camera Module For iPhone 7-15 Pro Max. MS1-14/15 module for iPhone 14-15 series. iRepair MS1 desoldering preheating platform for iPhone X-16 Pro Max motherboard CPU IC Dot matrix Face ID heating disassembly and glue removal.
PPD120ES Desoldering Preheating Platform For iPhone X-14 Pro Max module universal module + dot matrix module + follow-up unlimited upgrades.
Mijing MS1 Camera Module For iPhone 7-15 Pro Max:
-A: for iPhone 7/7P/8/8P/X/XR/XS/XS Max/11/11 Pro/11 Pro Max camera.
-B: for iPhone 12/12MiniI/12Pro/12 Pro Max/13/13 Mini/13 Pro/13 Pro Max camera.
-C: for iPhone 14/14 Plus/14 Pro/14 Pro Max Rear camera heating module.
-D: for iPhone 15/15 Plus/15 Pro Rear camera heating module.
-E: for iPhone 15 Pro Max Rear camera heating module.
Features:
- iRepair MS1 pre-heating station for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max /16/16 Plus/16 Pro/16 Pro Max、17/17 Air/17 Pro/17 Pro Max motherboard soldering separating.
- Newly upgraded heating element, fast heating, precise temperature control.
- Added countdown function, layering and fitting are more secure.
- iPhone X-17 Pro Max module + universal module + dot matrix module + follow-up unlimited upgrades.
- Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Parameters:
Brand: Mijing iRepair
Name: iRepair MS1 Multifunctional Desoldering Station
Packing size: 220*158*50 (mm)
MS1 upgrade expansion module
Packing size: 114*79*10 (mm)
