YCS M.Y Heat-Resistant Repair Thermal Pad 450*300*5mm Soldering Silicone Mat for Mobile Phone Repair. High temperature resistance, corrosion resistance, and odorless. Highly elastic and tough, it can be bent freely without deformation. Suitable for high-temperature repair work on mobile phone components, PCB, CPU, BGA chips, etc.
Features:
1. High Temperature Resistance: Withstands temperatures up to 500℃, suitable for high-temperature repair work.
2. Extra-Thick 5mm: The thick design provides better heat insulation performance, ensuring safe use in high-temperature environments.
3. High Elasticity and Toughness: Possesses excellent elasticity and toughness; the pad can be bent freely without deformation, ensuring high durability.
4. Corrosion Resistance: The material is corrosion-resistant, resulting in a long service life and preventing damage caused by environmental factors.
5. Odorless: Made with environmentally friendly materials, it has no harmful odor, ensuring a clean and safe operating environment.
6. One pad integration: Eliminates the hassle of multiple tools or pads required for traditional repairs, making functions more centralized and operation more convenient.
