M-TRIANGEL Laser Machine Auto Focus Version. M-triangel MG ones/PG ones separating engraving laser machine for phone middle frame and rear glass separating/disassembling/marking/engraving, it can also print logos for your products. Laser machine for Phone Back Glass Removing Repair, laser marking, laser separating, laser DIY Logo.
M-Triangel Intelligent Laser Separating Machine For iPhone XR XS Max X 8 Back Glass LCD Frame Removing Repair, Mobile Phone Back Glass Separate Laser Machine, DIY Logo machine Laser Marking Machine.
Features :
- Separate Midframe / Bezel / Back glass, Marking / Engraving
- Technology Upgrading----Intelligent Ranging System
- Easy operation, Come with Software and drawings (Continuous updating...)
- Suitable for all touch screen smart phones Laser Repair in the market: for IPhone, Huawei, XiaoMi, OPPO, Vivo,LG series;
- Many type of metals are workable: Gold, Silver, Stainless Steel, Copper, Aluminum, chrome Brass, etc.
- Alloy and metal oxides: Anodized Aluminum
- 12 months warranty, online technical support and training is provided.
Intelligent SP001 Parameters:
- Laser Power: 20W
- Machine Speed: ≤10000mm/s
- Marking power: ≤0.001MM
- Cooling method: built-in air cooling
- Laser wavelength: 1.06μm
- Laser equipment size: 300*560*570MM
- Power supply: 220V ± 10%, 50HZ ± 5%
- Ambient temperature: -10 ° C ~ 65 ° C
- Repeatability: ≤0.001mm
- Marking depth: 0.015-0.5mm
- Marking range: 175*175mm
- Marking line width: 0.05-0.01mm
- Equipment weight: 32kg
- Packing Size: 630x600x300mm
- Gross weight: 28kg
Automatic SP002 Parameters (MG ones):
- Laser Power : 20W
- Machine Speed:≤10000mm/s
- Marking power: ≤0.001MM
- Cooling method: built-in air cooling
- Laser wavelength: 1.06μm
- Laser equipment size: 300*496*548.5MM
- Power supply: 220V ± 10%, 50HZ ± 5%
- Ambient temperature: -10 ° C ~ 65 ° C
- Repeatability: ≤0.001mm
- Marking depth: 0.015-0.5mm
- Marking range: 175*175mm
- Marking line width: 0.05-0.01mm
- Equipment weight: 18.9kg
- Packing Size: 630x600x300mm
- Gross weight: 28.92kg
Computer SP003 Parameters(PG ones) :
- Laser Power: 20W
- Machine Speed:≤10000mm/s
- Marking power: ≤0.001MM
- Cooling method: built-in air cooling
- Laser wavelength: 1.06μm
- Laser equipment size: 300*538*588.5MM
- Power supply: 220V ± 10%, 50HZ ± 5%
- Ambient temperature: -10 ° C ~ 65 ° C
- Repeatability: ≤0.001mm
- Marking depth: 0.015-0.5mm
- Marking range: 175*175mm
- Marking line width: 0.05-0.01mm
- Equipment weight: 21.2kg
- Gross weight: 32kg