Mechanic 183℃ solder paste for motherboard CPU chips soldering repair. Mechanic XGSP30 XGSP40 XGSP50 XGSP80 XGSP200 XGSP500 Soldering Flux Paste BGA Solder Paste Soldering Tin Cream. Mechanic special solder paste flux for BGA chip soldering repair.
Parameters:
Melting Point: 183℃
Alloy: Sn63/Pb37
Microns: 20-38um
Storage conditions: 0-10℃, 12 months
Models(183℃):
XGSP30 20G
XGSP40 35G
XGSP50 42G
XGSP80 60G
XGSP200 200G
XGSP500 500G
Application: Suit for PCB and small components welding
Note: solder paste flux can only be sent out by special post mail.
Package List:
1x 183℃ Soldering Paste
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