PHONEFIX Chip Thermal Paste Phone Laptop CPU Heat Sink Grease

Phonefix Thermal Paste CPU processor chip heat sink compound for mobile phone laptop computer BGA semiconductor repair. Phonefix CPU thermal grease to maximize heat transfer and dissipation, used to improve thermal coupling between different components such as power transistors, CPU, GPU and LED COB, etc.

Features:
1. High and Low Temperature Resistant: -50℃ to 220℃.
2. Metal-Free, Electrical Insulation, Corrosion Resistance, Non-Damaging to Electronic Devices.
3. Rapid Cooling, Lasting Cooling Sensation. High Thermal Conductivity Silicone Gel that fills microscopic gaps and conducts heat quickly.
4. It offers high thermal conductivity, stable performance, and insulation safety with three options available.

Pleaste note: Paste flux can only be sent out by special post mail.

Specifications:
Product Name: Mobile Phone Thermal Paste
Thermal Conductivity: 4W/6W/8.5WMK
Thermal Resistance: 0.05°C-cm2
Density: 3.0
Viscosity: 350Pa·S
Dielectric Strength: 10Kv
Colors: Pink/Blue/Grey
Net Weight: 30g/40g/40g
Shelf Life: 2 years
Service Life: 2 years
Applicable Range: Mobile phones, laptops, desktop computers.