Phonefix Thermal Paste CPU processor chip heat sink compound for mobile phone laptop computer BGA semiconductor repair. Phonefix CPU thermal grease to maximize heat transfer and dissipation, used to improve thermal coupling between different components such as power transistors, CPU, GPU and LED COB, etc.
Features: 1. High and Low Temperature Resistant: -50℃ to 220℃. 2. Metal-Free, Electrical Insulation, Corrosion Resistance, Non-Damaging to Electronic Devices. 3. Rapid Cooling, Lasting Cooling Sensation. High Thermal Conductivity Silicone Gel that fills microscopic gaps and conducts heat quickly. 4. It offers high thermal conductivity, stable performance, and insulation safety with three options available.
Pleaste note: Paste flux can only be sent out by special post mail.
Specifications: Product Name: Mobile Phone Thermal Paste Thermal Conductivity: 4W/6W/8.5WMK Thermal Resistance: 0.05°C-cm2 Density: 3.0 Viscosity: 350Pa·S Dielectric Strength: 10Kv Colors: Pink/Blue/Grey Net Weight: 30g/40g/40g Shelf Life: 2 years Service Life: 2 years Applicable Range: Mobile phones, laptops, desktop computers.
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