2UUL BG01 ABCD BGA Reballing Stencil 4pcs/pack and BG03 stencil for iPhone 8-17 Pro Max all chips soldering and repair, including iPhone A11-A19 Pro CPU, Nand Flash chips, Baseband IC, WIFI IC, Screen IC, Face ID module, Charging port flex cable, Proximity sensor, True Tone sensor, Camera module, Radio Frequency IC, Power Amplifier IC, and other Small ICs.
Features:
1. The stencil covers all soldering points for iPhone 8-17 series, including:
· A: CPU, NAND Flash;
· B: Baseband IC, WiFi IC;
· C: RF, amplifier, and small chips;
· D: Display, face recognition, docking station board, infrared, True Tone, and camera.
2. Includes 4 blades for enhanced ease of use and precision.
3. Precision laser cutting ensures accurate solder joint placement.
4. Improves soldering quality and reduces rework.
5. Suitable for chip-level repairs on iPhone 8/X/XS Max/11/12/13/14/15/16/17 Pro Max, A11, A12, A13, A14, A15, A16, A17, A18, A19 Pro CPU.
Product Specifications
Name: 2UUL BG01 ABCD Reballing Stencil, 2UUL BG03 0.12mm reballing stencil.
Net Weight: 28g
Gross Weight: 35.4g
Dimensions: 100x85x0.1mm
Packaging Dimensions: 105x90x1.2mm
