Amaoe CPU Reballing Platform with stencil for iPhone A6-17 Pro CPU RAM chips soldering repair. Amaoe PD-C Tin Planting Pad high-temperature resistant insulating silicone pad for mobile phone BGA CPU chips reballing soldering repair. Amaoe PD-A reballing platform for Phone BGA CPU chips reballing glue removal repair. Amaoe CPU reballing platform with magnet base positioning plate and stencil for iPhone 6-15 Pro Max BGA CPU reballing.
Amaoe PD-C pad used with a magnetic positioning base and is suitable for tin implantation and welding of chips with a thickness of less than 0.9mm.
Amaoe PD-A Universal BGA Reballing Stencil Magnetic Base For Phone Motherboard Middle Frame CPU IC Chip Tin Planting Glue Removal.
Option:
1. A12 set for iPhone X series CPU.
2. A13 set for iPhone 11 series CPU.
3. A14 set for iPhone 12 series CPU.
4. A15 set for iPhone 13 series CPU.
5. A16 set for iPhone 14 series CPU.
6. A17 set for iPhone 15 series CPU.
7. A8-A13 set for iPhone 6-11 Pro Max CPU.
8. Amaoe PD-C Tin Planting Pad only.
9. Amaoe PD-C pad with magnet base set.
10: Amaoe PD-A set for chips reballing glue removing.
11. 0.12mm Amaoe U-APU1 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
12. 0.12mm Amaoe U-APU2 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
13. 0.12mm Amaoe U-APU3 stencil for A10 A11 A12 A13 A14 A15 A16 RAM.
14. 0.12mm Amaoe U-APU4 stencil for A10 A11 A12 A13 A14 A15 A16 RAM.
15. 0.12mm Amaoe U-APU5 stencil for A6 A7 A8 A9 RAM.
16. 0.12mm Amaoe U-APU6 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
17. 0.12mm Amaoe U-APU7 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
18. 0.12mm Amaoe U-APU8 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
19. 0.12mm Amaoe U-APU1-8 stencil for A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU RAM.
