Amaoe CPU Reballing Platform with A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 Pro stencil for iPhone 6-17 Pro Max CPU RAM chip tin planting soldering repair. Amaoe iPhone CPU reballing platform with magnet base positioning plate and BGA steel mesh for iPhone 6/7/8/X/11/12/13/14/15/16/17 Pro Max motherboard CPU reballing.
Option:
1. A12 set for iPhone X series A12 CPU.
2. A13 set for iPhone 11 series A13 CPU.
3. A14 set for iPhone 12 series A14 CPU.
4. A15 set for iPhone 13 series A15 CPU.
5. A16 set for iPhone 14 series A16 CPU.
6. A17 set for iPhone 15 series A17 CPU.
7. A18/A18 Pro set for iPhone 16 series A18/A18 Pro CPU.
8. Mbga-B12 Set: for iPhone 6-16 Pro Max A8-A18 Pro CPU reballing. .
9. Amaoe PD-C pad with magnet base set.
10: Amaoe PD-A set for chips reballing glue removing.
11. 0.12mm Amaoe U-APU1 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
12. 0.12mm Amaoe U-APU2 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
13. 0.12mm Amaoe U-APU3 stencil for A10 A11 A12 A13 A14 A15 A16 RAM.
14. 0.12mm Amaoe U-APU4 stencil for A10 A11 A12 A13 A14 A15 A16 RAM.
15. 0.12mm Amaoe U-APU5 stencil for A6 A7 A8 A9 RAM.
16. 0.12mm Amaoe U-APU6 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
17. 0.12mm Amaoe U-APU7 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
18. 0.12mm Amaoe U-APU8 stencil for A10 A11 A12 A13 A14 A15 A16 CPU.
20. 0.1mm Amaoe U-APU9 stencil for A16 A17 A18 Pro CPU RAM.
21. A19/A19 Pro set for iPhone 17/Air/17 Pro/17 Pro Max CPU.
Amaoe PD-C pad used with a magnetic positioning base and is suitable for tin implantation and welding of chips with a thickness of less than 0.9mm.
Amaoe PD-A Universal BGA Reballing Stencil Magnetic Base For Phone Motherboard Middle Frame CPU IC Chip Tin Planting Glue Removal.
