AMAOE BGA253 BGA190 Reballing Stencil is a stencil specifically designed for DDR LPDDR3 resoldering BGA (Ball Grid Array) chips, such as video memory chips and graphics processing chips. The AMAOE BGA Reballing Stencil is used for soldering and re-implanting solder balls for BGA chips. Using this template, chip soldering, rework, and resoldering can be easily achieved.
Feature
1. High-precision design: Utilizes a high-quality stencil to ensure precise placement of each solder ball, resulting in a smoother soldering process.
2. Wide compatibility: Suitable for various video memory chips and graphics chips, especially for soldering and reworking BGA chips.
3. High durability: The stencil material is robust and durable, withstanding multiple uses.
4. Convenient and efficient: Provides precise solder ball positioning for the soldering process, improving repair efficiency and reducing operational difficulty.
5. Suitable for the electronics repair industry, especially for BGA chip soldering and rework of electronic devices such as computers, mobile phones, and game consoles.
Option
1. A2179 DDR Memory Chip 0.15mm
2. A2179 DDR Memory Chip Mounting Board
3. A2179 DDR Memory Chip Reflow Stand Kit
4. DDR5X-BGA190 Graphics Card 0.25mm
5. DDR5X-BGA190 Graphics Card Mounting Board
6. DDR5X-BGA190 Graphics Card Reflow Stand Kit
7. DDR-BGA96 7in1 Reflow Stand Kit
8. DDR-BGA96 Mounting Board
9. DDR Memory BGA78 Kit
10. DDR Memory BGA178 Reflow Stand Kit
11. GDDR567 Mounting Board
12. LPDDR3 BGA253 0.15mm Stencil
13. LPDDR3 BGA253 11x11.5 Mounting Board
14. LPDDR3 BGA253 11x11 mounting board
15. LPDDR3 BGA253 12x12 mounting board
16. LPDDR3 BGA253 resoldering station kit
17. DDR7 BGA266 0.25mm stencil
18. GDDR567 memory resoldering station kit
