AMAOE GDDR7 GDDR6 GDDR5 BGA Reballing Platform for BGA266 BGA180 BGA170 Memory Chips Tin Planting and Soldering Repair. It comes equipped with a universal alignment plate, a magnetic base, and solder paste squeegees, making it suitable for repairing GDDR-series memory chips found in graphics cards, GPUs, and high-performance electronic devices.
Features:
1. Supports reballing for multiple generations of memory chips (GDDR5/GDDR6/GDDR7) to meet diverse graphics card repair needs.
2. Features a high-precision BGA stencil design with accurate solder ball alignment, increasing the success rate of the reballing process.
3. Includes a dedicated alignment plate for rapid positioning, minimizing chip misalignment issues.
4. The magnetic base ensures stable fixation, keeping the chip securely in place during repairs.
5. Suitable for memory IC rework, reballing, and BGA soldering processes, enhancing repair efficiency.
6. Designed for use with non-magnetic squeegee blades, ensuring smoother paste application and reducing potential damage to the stencil.
7. Modular design allows for the flexible selection of the appropriate stencil based on the specific memory chip model.
Options:
1. GDDR5/6/7 Reballing Station
2. GDDR5 BGA170 Reballing Stencil
3. GDDR6 BGA180 Reballing Stencil
4. GDDR7 BGA266 Reballing Stencil
5. Universal Alignment Plate for GDDR5/GDDR6/GDDR7
6. Magnetic Base (includes 2 non-magnetic squeegee blades)
