Amaoe Middle Layer BGA Reballing Platform with 0.12mm stencil for Samsung Galaxy S Series, including S25 Ultra, S25/S25 Plus, S24 FE, S24, S24+ S24 Ultra S928U, S23 Ultra S918U, S23+, S22, S22 Ultra, ect. Amaoe Samsung Middle Layer Planting Tin Platform with positioning mold, magnet base, and BGA stencil for Samsung motherboard soldering repair.
Option:
1. Samsung S24 Ultra S928U middle layer reballing platform set.
2. Samsung S23 Ultra S918U middle layer reballing platform set.
3. Samsung S23+ SM S916U/S911 back side middle layer reballing platform set.
4. Samsung S22 Ultra S908U/B middle layer reballing platform set.
5. Samsung S22 Ultra S908U/B back side middle layer reballing platform set.
6. Samsung S22 SM-S901U middle layer reballing platform set.
7. Samsung S22 SM-S901U back side middle layer reballing platform set.
8. Samsung S21 Ultra SM-G998U middle layer reballing platform set.
9. Samsung S21 SM-G991U middle layer reballing platform set.
10. Samsung S25/25+ S931/936ALL reverse middle layer reballing platform set.
11. Samsung S25 Ultra S938 reverse middle layer reballing platform set.
12. Samsung S24 FE SM-S721B reverse middle layer reballing platform set.
13. Samsung S24 SM-S921U reverse middle layer reballing platform set.
14. Samsung S24+ SM-S926U middle layer reballing platform set.
Features:
1. Built-in strong magnet/using high temperature synthetic stone/precision lamination/continuous upgrade expansion module.
2. Support Samsung series cell phone motherboard tinning and subsequent continuous upgrading, and the base is universal, to avoid repeated purchases.
3. Precision alignment, side slot design, take the steel mesh through the corners to avoid a large area of the mesh at the same time out of the solder paste is taken away.
4. Built-in three powerful magnets in the base, which can effectively prevent the stencil from moving slightly, resulting in poor tinning effect.
