WL HT007 intelligent mainboard heating layered soldering desoldering station for iPhone X-17 Pro Max. WL HT007 motherboard layered soldering station with iPhone X/11/12/13/14/15/16/17 Pro Max heating module for motherboard separation and soldering repair.
Features:
1. Support 110V-220V voltage, output safe voltage 24V DC high-performance intelligent welding station.
2. Support real-time operation on the PC side, computer control, timely warning of tin melting, customizable time, and soldering iron
3. The dynamic temperature is displayed in real-time by a microcomputer and the eddy current heating system makes the power smaller and the heating efficiency higher.
4. Hibernation function, one-click memory temperature function.
5. The resistance heating + electromagnetic induction heating at the same time make the eddy current heating more powerful.
6. The optimum precise welding temperature can be calculated in real-time by synchronous ambient temperature, which makes the welding work more ideal and convenient.
7. Incorporates timer/dormancy function.
8. User-defined open channels.
9. Heating the central column only.
10. Protect motherboard IC from damage.
WL HT007 set:
1x WL HT007 host.
1x iPhone X-11 Pro Max 6 in 1 heating mold with stencil.
1x iPhone 12 series 4 in 1 heating mold with stencil.
1x iPhone 13mini/13 Pro 2 in 1 heating mold with stencil.
1x iPhone 13/13 Pro Max 2 in 1 heating mold with stencil.
1x iPhone 14 series 4 in 1 heating mold with stencil.
1x iPhone 15 series 4 in 1 heating mold with stencil.
1x iPhone 16 series 4 in 1 heating mold with stencil.
1x iPhone 17/17 Air/17 Pro/17 Pro Max mold (no stencil). (Please note that the iPhone 17 series module do not come with a soldering mesh and can only be used for heating separation and bonding to the motherboard.)
