Leaded Solder Balls 0.15mm-0.0889mm Sn63/Pb37 Tin Ball BGA Reballing Kit for iPhone, Mobile Phone, Electronics Motherboard Repair. High-quality leaded solder balls are designed for professional BGA reballing and chip-level motherboard repair. High-precision spheres ensure reliable solder joints and consistent ball placement. Consistent ball size, uniform melting, and reliable electrical connections.
Solder Ball Size:
0.15mm: 1000,000pcs or 100,000pcs.
0.2mm: 250,000 pcs or 25,000pcs.
0.25mm: 250,000 pcs or 25,000pcs.
0.3mm: 250,000 pcs or 25,000pcs.
0.35mm: 250,000 pcs or 25,000pcs.
0.4mm: 250,000 pcs or 25,000pcs.
0.45mm: 250,000 pcs or 25,000pcs.
0.5mm: 250,000 pcs or 25,000pcs.
0.55mm: 250,000 pcs or 25,000pcs.
0.6mm: 250,000 pcs or 25,000pcs.
0.64mm: 250,000 pcs or 25,000pcs.
0.76mm: 250,000 pcs or10,000pcs.
0.889mm: 100,000pcs or 10,000pcs.
Pleast note: the soldering tin balls can only be sent out by special post.
Features:
1. Sn63/Pb37 alloy – Low melting point, excellent wetting, and strong joint reliability
2. Ultra-fine pitch sizes – 0.15mm and 0.0889mm for small BGA chips
3. High precision – Uniform diameter ±0.005mm
4. Professional packaging – Sealed bottles prevent oxidation and moisture
5. Multiple quantities – Available in 10,000 pcs, 25,000 pcs, or 100,000 pcs per bottle
Ideal for:
iPhone / Samsung / Google Pixel BGA reballing.
Laptop & desktop motherboard repair.
Gaming console repair (PS5, Xbox, Nintendo Switch).
Tablet and iPad chip repair.
General electronics and PCB rework.
Specifications:
Alloy: Sn63/Pb37 (leaded)
Melting point: 183°C (361°F)
Ball size tolerance: ±0.005mm
Storage: Store in cool, dry place
