Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max

AMAOE Mbga-IP WiFi/Baseband/CPU/NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7-15 Pro Max.Mbga-IP 26 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair.

Option:
Mbga-IP 26 in 1 set ( 7-15PM)
Mbga-IP 14/14P kit Positioning plate
Mbga-IP 12/13 kit Positioning plate
Mbga-IP XS/11 kit Positioning plate
Mbga-IP 7/8/X Qualcomm kit Positioning plate
Mbga-IP 7/8/X Intel Kit Positioning plate
M-IP14-A16 stencil Kit (0.12mm)
M-IP14-A15 stencil Kit (0.12mm)
M-IP13 stencil Kit (0.12mm)
M-IP12 stencil Kit (0.12mm)
M-IP11 stencil Kit (0.12mm)
M-IPXS stencil Kit (0.12mm)
M-IP8 Qualcomm stencil(0.12mm)
M-IP8-i Intel stencil (0.12mm)
M-IP7 Qualcomm stencil (0.12mm)
M-IP7-i Intel stencil (0.12mm)
Mbga/MFix-UBase base

Features:

• The compatible brand of our product is apple iPhone. Product original from CN(origin).
• The compatible model is iPhone 7/7P/8/8P/X/XS/XS MAX/XR/11/11 Pro/11 Pro Max/12/12 mini/12 Pro/12 Pro Max/13/13 Pro/13 mini/13 Pro Max/14/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max.
• Tin planting and glue removal two-in-one design,Can be partially implanted with tin to remove glue and fix the chip.