RF4 PCB Holder Soldering Fixtures: RF-FT02, RF-FT04, RF-FT05, RF-FT06, RF-FT07, RF-FT09, RF-FT3X used to clamp and fix mobile phone motherboard CPU BGA IC for repair. RF4 universal high-temperature resistant PCB holder fixture IC soldering clamp for mobile phone laptops tablets motherboard repair.
Option:
1. RF4 RF-FT02 fixture.
2. RF4 RF-FT04 fixture.
3. RF4 RF-FT05 fixture.
4. RF4 RF-FT06 fixutre.
5. RF4 RF-FT07 fixutre.
6. RF4 RF-FT09 fixutre.
7. RF4 RF-FT3X fixture.
RF4 RF-FT03, RF-FT11, and RF-FT33 have been discontinued.
RF4 RF-FT3X Glass Fixture Features:
1. RF4 RF-FT3X Multifunctional Heat-Insulated PCB Repair Glass Clamp, suitable for mobile phone PCB board repair.
2. Securely clamps and supports large BGA chips, ensuring safer soldering.
3. Two sliders move independently, allowing for precise adjustment to the left and right sides.
4. Compatible with various mobile phone PCBs, providing stable clamping force even on irregularly shaped surfaces.
5. Three rotation modes allow for free rotation and locking, easily handling complex angles.
RF-FT02 Features:
1. RF4 RF-FT02 fixture is small and delicate, two-way mobile design, with the motherboard suspension function to ensure the stability of the motherboard and durability.
2. Mini fixture compact and practical, bidirectional movement, can be used for chip CPU motherboards.
3. The internal bevel design gives the motherboard a stronger grip.
4. The motherboard can be suspended to effectively prevent the heat loss caused by heat conduction of the motherboard and fast welding protection of the motherboard.
5. RF-FT02 fixture size: about 66*92.5mm.
RF4 RF-FT09 Fixture Features:
1. RF4 RF-FT09 Trackless Planar Universal CPU IC Chip Glue Removal and Repair Fixture.
2. Suitable for removing glue from BGA, CPU, IC and other mobile phone motherboard components and repairing pins.
3. Seamless flat structure for free clamping; maximum clamping size: 21mm*46mm.
4. Press and release for quick fixation; abandons traditional screw design, one-handed press to open, release to lock.
5. CNC precision one-piece molding, durable and highly reliable.
RF4 RF-FT07 Glass Fixture Features:
1. RF4 RF-FT07 Dual-Axis High-Temperature Strengthening Glass Motherboard Repair Fixture for Mobile Phone Repair.
2. Suitable for clamping and maintaining motherboards, chips, CPUs, hard drives, and other precision integrated circuits requiring adhesive removal.
3. Compatible with 99% of mobile phone motherboards/can clamp CPUs/supports irregularly shaped/Android motherboards.
4. High-strength, easy-to-clean heat-insulating tempered glass surface, heat resistant up to 500℃, will not deform after long-term use, fearless of high temperatures.
5. Double-layer clamping design, precise and secure clamping, custom clamping for Android motherboards, compatible with slide rails, can clamp 99% of devices.
RF4 RF-FT06 Glass Fixture Features:
1. RF4 RF-FT06 Mini Heat-Resistant Glass Fixture Phone Chip Motherboard Repair Holder.
2. This mini heat-resistant glass chip motherboard repair clamp features a universal chip slot structure, firmly clamping the motherboard and chips for quick positioning. It's suitable for repairing various mobile phone IC chips.
3. The knob-type clamping mechanism ensures smooth, non-jamming slider movement, precise and secure clamping, and compatibility with most motherboards. It withstands temperatures exceeding 500℃, maintaining its shape even after long-term use.
4. The bidirectional movement offers strong compatibility, suitable for motherboard repair, chip adhesive removal, and more. It supports clamping a wider range of chips, including CPUs and hard drives.
RF-FT04 Features:
1. Carbon fiber material, heat-resistant endurance. Single-axis bidirectional self-adaptive one-clamp precision for chips.
2. Zero deformation desoldering. Dual-sliding flexible adjustment fixation for all components.
RF-FT05 Features:
1. Universal motherboard precision fit. Dual-axis unidirectional locking zero displacement desoldering
2. Darbon fiber shield: anti-corrosion & heat-resistant, vibration-free clamping.
