RF4 RF-106A 0.6mm 108A RF-0.8mm 100g / RF-203D 0.3mm RF-204D 0.4mm RF-206D 0.6mm RF-208D 0.8mm RF-210D 1.0mm 200g Sn63% Lead-Free Rosin Core Solder Tin Wire. RF4 BGA desoldering wire for mobile phone motherboard SMD PCB welding repair tool.
Features:
- Environmentally friendly and lead-free.
- Good wettability, conductivity, and resistance to heat fatigue.
- The solder joint is smooth and it can effectively resist oxidation.
- Fast spreading speed even with small holes.
- The solder wire is wound up evenly with a roll for easy sorting and preservation.
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Options:
- Option1: RF4 RF-106A 100g 0.6mm
- Option2: RF4 RF-108A 100g 0.8mm
- Option3: RF4 RF-203D 200g 0.3mm
- Option4: RF4 RF-204D 200g 0.4mm
- Option5: RF4 RF-206D 200g 0.6mm
- Option6: RF4 RF-208D 200g 0.8mm
- Option7: RF4 RF-210D 200g 1.0mm
How to Use:
- Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick. The solder will be absorbed.
- Remove both the desoldering wick and the soldering iron tip from the PCB after the solder has been absorbed.
- Cut off the used section of the wick using nippers.
- Repeat steps 1,2 and 3 if the solder is not removed completely. Absorbability may differ depending on the type of solder. Sn63% and 60% (tin content) have good absorbability.
Caution:
- To prevent injury, do not touch the wicks directly while desoldering. Hold the case, or use tweezers, etc.
- Do not force the tip against the desoldering wick, do not heat for more than 5 seconds to avoid hurting yourself or damaging parts and PCB.
Warning:
- Only touch the grip and the pack of desoldering wick when desoldering. Failure to do so will result in serious burns.
- To avoid fire, never use a soldering iron and desoldering wick around combustibles or in an explosive environment.
Package includes:
