Sunshine SS-T12B Intelligent Heating Platform for iPhone 7-17 Pro Max, Samsung S23-S24 Ultra, mobile phone motherboard preheating separation desoldering repair. SS-T12B Multi-functional universal intelligent maintenance heating separator platform supports Android+iPhone series Motherboard Heating groove for iPhone X/11/12/13/14/15/16/17 Pro Max Android Phone motherboard CPU Face ID repair.
Features:
- SS-T12B Heater Platform Supports bonding and separation of Android and IP7G-16PM motherboards,separation of screen frame,etc.,fast and accurate layering, tin planting, glue removal,and bonding of motherboards,etc.
- Modular design,A variety of combined modules,common modules on the base,good scalability, easy to expand new modules.
- The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components,which is more convenient and quick.
- Intelligent temperature control, customized temperature adjustment according to different melting points,with fast heating, long life and uniform temperature.
- 360°rotating buckle + guide rail design,suitable for precise clamping of motherboards of different shapes,improving maintenance efficiency.
- The module is equipped with a positioning column,which can be accurately separated and attached to the main board,and is easy to take.
- Hollow heat dissipation design,high temperature resistance; Silicone wear-resistant foot pads,stable operation,good anti-skid effect.
The Modules Use for:
T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair.
T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination.
T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering.
T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering.
T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering.
T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering.
T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera.
T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera.
T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera.
T12B-IP10: Android universal.
T12B-IP11: for iPhone 15/15 Plus/15 Pro/15 Pro Max/A16/A17 motherboard layering.
T12B-IP12: for iPhone 16/16 Plus/16 Pro/16 Pro Max/A18 motherboard layering.
T12B-IP13: for iPhone 17/17 Pro Max motherboard layering.
T12B-IP13: for iPhone 17 Air/17 Pro motherboard layering.
T12B-SAM1 mold: for Samsung S23.
T12B-SAM2 mold: for Samsung S23+.
T12B-SAM3 mold: for Samsung S23 Ultra.
T12B-SAM4 mold: for Samsung S24.
T12B-SAM5 mold: for Samsung S24 Plus.
T12B-SAM6 mold: for Samsung S24 Ultra.
