XINZHIZAO X360 2nd Gen Intelligent heating table welding platform For IPhone X-14 PRO MAX motherboard dot matrix prejector CPU IC Camera repair. XINZHIZAO X360II preheating platform for iPhone X-14 Pro Max motherboard, A8-A16 CPU, Face ID, camera, Android Phone motherboard. X360II motherboard layered heating platform for iPhone motherboard separation or fit.
Features:
1. No damage to the motherboard, intelligent digital display, precise temperature control.
2. The module is equipped with positioning posts, which can be accurately separated and attached to the main board.
3. Fast heating, long life, fast heat compensation speed and low power consumption.
4. Adjustable digital tube temperature display, can observe the current heating temperature in real time, making maintenance and desoldering easier and more convenient.
5. Support modular expansion, modules can be switched at will, support X-14 PRO MAX separation and bonding.
Product information:
Brand: XINZHIZAO
MODEL: X360II intelligent heating platform
Material: Synthetic stone
Power: 110V/220W
Voltage: 110V/220V
SIZE: 148*128*48MM
Temperature: 50-260 degrees
Models available: iPhone X-14 PRO MAX, Android motherboard, A8-A13 CPU, Face ID.
Option:
1. iPhone X-14 Pro Max + Face ID Set:
1x X360II Host
1x Universal Platform
1x iPhone X/XS/XSM heating mold
1x iPhone 11/11P/11PM heating mold
1x iPhone 12mini heating mold
1x iPhone 12/12P/12PM heating mold
1x iPhone 13/13mini heating mold
1x iPhone 13/13PM heating mold
1x iPhone 14/14 Plus/14 Pro/14 Pro Max heating mold.
1x iPhone Face ID Dot Matrix CPU IC heating mold.
2. iPhone X-14 Pro Max Full Set:
1x X360II Host
1x Universal Platform
1x iPhone X/XS/XSM heating mold
1x iPhone 11/11P/11PM heating mold
1x iPhone 12mini heating mold
1x iPhone 12/12P/12PM heating mold
1x iPhone 13/13mini heating mold
1x iPhone 13/13PM heating mold
1x iPhone 14/14 Plus/14 Pro/14 Pro Max heating mold.
1x iPhone Face ID Dot Matrix CPU IC heating mold.
1x iPhone 6-12 Pro Max camera mold.
