XZZ AR Series SAM Motherboard Middle Layer Planting Tin Platform for Samsung S21 Ultra, S22 Ultra, S23 Ultra, S24 Ultra and S25 Ultra. XINZHIZAO XZZ Samsung motherboard reballing platform with C6 magnetic base, S21U S22U S23U S24U S25U positioning platform and mid layer stencil for Samsung motherboard soldering repair.
Features:
1. Edge groove design, convenient access to steel mesh. Take the steel mesh from the corners to avoid large areas of mesh detachment at the same time, which may cause the solder paste to be taken away.
2. Strong adsorption function, magnetic stability. Built in three large magnets, which can tightly connect the steel mesh with the tin planting table.
3. Extended universal base, the model is continuously being updated. No need to replace the base, one-time purchase, long-term use.
4. Precise positioning with tight seams, high precision reduces errors and high precision equipment processing and manufacturing, with
errors close to zero, improves maintenance efficiency, and avoids repeated operations due to insufficient solder paste.
5. Made of high-quality steel, crafted with precision, wear-resistant, and high toughness. Selected high-quality steel to create steel mesh, with good rebound performance and long-lasting durability.
Option:
1. S21 Ultra positioning platform with mid layer stencil.
2. S22 Ultra positioning platform with mid layer stencil.
3. S23 Ultra positioning platform with mid layer stencil.
4. S24 Ultra positioning platform with mid layer stencil.
5. S25 Ultra positioning platform with mid layer stencil.
6. C6 Magnetic Base
7. Full Set
Product Parameters:
Brand: XZZ
Product Name: SAM Mid Layer Tin Planting Platform
C6 base size: 106x85x8mm
Tin planting table size:106x85x5mm
Supported models: SAM S21/S22/S23/S24 Ultra
