XZZ AR Series SAM Motherboard Middle Layer Planting Tin Platform for Samsung S20-S26 Ultra. XINZHIZAO XZZ Samsung motherboard reballing platform with C6 magnetic base, S20-S25, S20 Plus-S25+, S20 Ultra-S26U positioning platform and mid layer stencil for Samsung motherboard soldering repair.
Models:
S20 Ultra, S21 Ultra, S22 Ultra, S23 Ultra, S24 Ultra, S25 Ultra, S26 Ultra positioning platform with mid layer stencil.
S20, S21, S22, S23, S24, S25 positioning platform with mid layer stencil.
S20+, S21+, S22+, S23+, S24+, S25 Plus positioning platform with mid layer stencil.
C6 Magnetic Base
Features:
1. Edge groove design, convenient access to steel mesh. Take the steel mesh from the corners to avoid large areas of mesh detachment at the same time, which may cause the solder paste to be taken away.
2. Strong adsorption function, magnetic stability. Built in three large magnets, which can tightly connect the steel mesh with the tin planting table.
3. Extended universal base, the model is continuously being updated. No need to replace the base, one-time purchase, long-term use.
4. Precise positioning with tight seams, high precision reduces errors and high precision equipment processing and manufacturing, with
errors close to zero, improves maintenance efficiency, and avoids repeated operations due to insufficient solder paste.
5. Made of high-quality steel, crafted with precision, wear-resistant, and high toughness. Selected high-quality steel to create steel mesh, with good rebound performance and long-lasting durability.
Product Parameters:
Brand: XZZ
Product Name: SAM Mid Layer Tin Planting Platform
C6 base size: 106x85x8mm
Tin planting table size:106x85x5mm
Supported models: for Samsung S20-S26 Ultra.
