XZZ TR middle layer reballing platform for iPhone X/11/12/13/14/15/16/17 Pro Max motherboard mid-frame soldering repair. XinzhiZao XZZ TR BGA Reballing Stencil with positioning mold and universal base for iPhone X-17 Pro Max motherboard middle frame tin planting repair.
Option:
1. XZZ TR Middle layer reballing platform for iPhone X-17 Pro Max.
2. XZZ TR Middle Frame BGA Plant Tin Platform for iPhone X-16 Pro Max/16e.
3. XZZ TR-17 Series mold for iPhone 17/17 Air/17 Pro/17 Pro Max
4. XZZ TR-16 Series mold for iPhone 16/16 Plus/16 Pro/16 Pro Max/16e.
5. XZZ TR-15 Series mold for iPhone 15/15 Plus/15 Pro/15 Pro Max.
6. XZZ TR-14 Series mold for iPhone 14/14 Plus/14 Pro/14 Pro Max.
7. XZZ TR-13 Series mold for iPhone 13/13 mini/13 Pro/13 Pro Max.
8. XZZ TR-12 Series mold for iPhone 12/12 mini/12 Pro/12 Pro Max.
9. XZZ TR-X-11 Series mold for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max.
Features:
1. Strong magnetic adsorption, built-in strong magnetic.
2. Non-disassembling, easy to use.
3. Position quickly.
4. High-temperature resistance and abrasion resistance imported alloy steel, metal fatigue resistance, make the product use more durable.
5. Imported alloy steel, high material, and technology, anti-fouling, easy to clean.
6. Suitable for iPhone A8 A9 A10 a11 A12 A13 A14 A15 A16 A17 A18 A19 Pro CPU, iPhone X-16 Pro Max middle layer frame.
7. 0.12mm stencil: the square hole is not completely pierced.
8: Magnetic base, positioning plate, stencil.
Installation:
1. Separate the magnetic base and positioning plate, secure the IC to the corresponding position (needs to be consistent with the direction of the steel mesh).
2. Place the steel mesh directly on the slot (note that the mesh is aligned with the bottom chip).
3. Place the positioning plate on the magnetic base, the installation is complete.
4. Preheat the stencil with a hot air gun, and then blow it in the IC opening position.
