YCS Repairer CPU Magnet Reballing U Platform for iPhone 6-17 Pro Max A8-A19 Pro CPU, Qualcomm, HiSilicon, MediaTek and Samsung CPU Tin Planting Glue Removal Repair. YCS CPU reballing platform with tin planting steel mesh for mobile phone CPU chip soldering repair.
Option:
1. YCS U Platform CPU Reballing Platform.
2. YCS iPhone A8-A19 Pro CPU reballing stencil 14PCS/set.
3. YCS Qualcomm CPU reballing stencil 24PCS/set, 41pcs/set.
4. YCS HiSilicon CPU reballing stencil 10PCS/set, 12pcs/set.
5. YCS MediaTek Dimensity CPU reballing stencil 15PCS/set, 23pcs/set.
6. YCS Samsung CPU reballing stencil 7PCS/set, 13pcs/set.
7. YCS Kirin CPU reballing stencil 4PCS/set.
Features:
1. Tight clamping, precise clamping, more stable operation, less likely to damage the chip.
2. High temperature and corrosion resistance, high quality synthetic stone, high strength, anti-fouling and easy to clean.
3. Glue removal, tin implantation, U protection, a good machine multi-purpose, magnetic design, stable and firm, high temperature resistance, durable.
4. Anti-slip rubber foot pads, wear-resistant and anti-slip, enhanced stability, easier maintenance.
Product Parameters:
Name: YCS Repairer U-Platform
Brand: YCS Repairer
Size: 85x60x19mm
Function: degumming, detinning, U-table
Gross weight: 97g
Material: synthetic stone
